The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2007
Filed:
Oct. 16, 2003
Sergey D. Lopatin, Santa Clara, CA (US);
Paul R. Besser, Sunnyvale, CA (US);
Alline F. Myers, Santa Clara, CA (US);
Jeremias D. Romero, Hayward, CA (US);
Minh Q. Tran, Milpitas, CA (US);
LU You, San Jose, CA (US);
Pin-chin Connie Wang, Menlo Park, CA (US);
Sergey D. Lopatin, Santa Clara, CA (US);
Paul R. Besser, Sunnyvale, CA (US);
Alline F. Myers, Santa Clara, CA (US);
Jeremias D. Romero, Hayward, CA (US);
Minh Q. Tran, Milpitas, CA (US);
Lu You, San Jose, CA (US);
Pin-Chin Connie Wang, Menlo Park, CA (US);
Advanced Micro Devices, Inc., Sunnyvale, CA (US);
Abstract
An exemplary embodiment is related to a method of using an adhesion precursor in an integrated circuit fabrication process. The method includes providing a gas of material over a dielectric material and providing a copper layer over an adhesion precursor layer. The adhesion precursor layer is formed by the gas, and the dielectric material includes an aperture.