The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 09, 2007

Filed:

Aug. 04, 2003
Applicants:

Neil J. Goldfine, Newton, MA (US);

Darrell E. Schlicker, Watertown, MA (US);

David C. Clark, Arlington, MA (US);

Karen E. Walrath, Arlington, MA (US);

Volker Weiss, Syracuse, NY (US);

William M. Chepolis, Viero, FL (US);

Andrew P. Washabaugh, Chula Vista, CA (US);

Vladimir A. Zilberstein, Chestnut Hill, MA (US);

Vladimir Tsukernik, West Roxbury, MA (US);

Inventors:

Neil J. Goldfine, Newton, MA (US);

Darrell E. Schlicker, Watertown, MA (US);

David C. Clark, Arlington, MA (US);

Karen E. Walrath, Arlington, MA (US);

Volker Weiss, Syracuse, NY (US);

William M. Chepolis, Viero, FL (US);

Andrew P. Washabaugh, Chula Vista, CA (US);

Vladimir A. Zilberstein, Chestnut Hill, MA (US);

Vladimir Tsukernik, West Roxbury, MA (US);

Assignee:

Jentek Sensors, Inc., Waltham, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 27/90 (2006.01); G01N 27/82 (2006.01);
U.S. Cl.
CPC ...
Abstract

Material condition monitoring may be performed by electromagnetic sensors and sensor arrays mounted to the material surface. The sensors typically have a periodic winding or electrode structure that creates a periodic sensing field when driven by an electrical signal. The sensors can be thin and flexible so that they conform to the surface of the test material. They can also be mounted such that they do not significantly modify the environmental exposure conditions for the test material, such as by creating stand-off gaps between the sensor and material surface or by perforating the sensor substrate.


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