The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 09, 2007

Filed:

Jan. 09, 2004
Applicants:

Ichiro Kodaka, Berkeley, CA (US);

Charles Sischile, Alameda, CA (US);

Alvin Timbang, Union City, CA (US);

Margarita Castillo, Union City, CA (US);

Claughton Miller, San Carlos, CA (US);

Inventors:

Ichiro Kodaka, Berkeley, CA (US);

Charles Sischile, Alameda, CA (US);

Alvin Timbang, Union City, CA (US);

Margarita Castillo, Union City, CA (US);

Claughton Miller, San Carlos, CA (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24D 11/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A device and method for laminating CMP pads includes supporting the CMP pad with a board having material compositions similar to the CMP pad. By thus supporting the CMP pad during lamination, there is less likelihood of damage to the CMP pad and better adhesion from lamination. In particular, the CMP pad materials are laminated while in contact with a first board that may have a recess to accept the CMP pad. The pad has dimensions that are equal to or greater than the pad material. In an alternative embodiment, a board is provided on the opposite side of the CMP pad for lamination.


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