The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 26, 2006
Filed:
Nov. 30, 2004
Chang-hoon Lee, Cheonan-si, KR;
Byung-am Lee, Suwon-si, KR;
Byung-seol Ahn, Suwon-si, KR;
Jae-sun Cho, Suwon-si, KR;
Joo-woo Kim, Seoul, KR;
Sung-man Lee, Suwon-si, KR;
Chang-Hoon Lee, Cheonan-si, KR;
Byung-Am Lee, Suwon-si, KR;
Byung-Seol Ahn, Suwon-si, KR;
Jae-Sun Cho, Suwon-si, KR;
Joo-Woo Kim, Seoul, KR;
Sung-Man Lee, Suwon-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
A wafer pattern inspecting apparatus and method are disclosed. The apparatus comprises an image sensor to acquire image data from a reference die and a sample die, an external memory to store the image data, an encoder to compress the data, a decoder to decompress the data, an internal memory device to store the compressed image data of the reference die, an arithmetic module to process the image data for the reference dies to extract a reference image data, a reference storage memory to store compressed reference image data, and a comparison module to compare the sample die image data with the reference image data to an extract defect data for the sample die.