The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 26, 2006
Filed:
Nov. 20, 2003
Applicants:
Hsin-hui Lee, Kaohsiung, TW;
Pei-hwa Tsao, Taichung, TW;
Chao-yuan Su, Koahsiung, TW;
Inventors:
Assignee:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method for encapsulating an integrated circuit chip is described. An intergrated circuit chip is attached to a substrate; a stress buffering material only covers corners of the integrated circuit chip; and an encapsulation material coats the integated circuit chip and a portion of the substrate.
Lee, Hsin-Hui. (2006). Encapsulation method for sbga (U.S. Patent No. 7154185). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7154185
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile