The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2006
Filed:
May. 17, 2004
Tohru Fujinawa, Ibaraki, JP;
Masami Yusa, Ibaraki, JP;
Satoyuki Nomura, Ibaraki, JP;
Hiroshi Ono, Ibaraki, JP;
Itsuo Watanabe, Ibaraki, JP;
Motohiro Arifuku, Ibaraki, JP;
Hoko Kanazawa, Ibaraki, JP;
Tohru Fujinawa, Ibaraki, JP;
Masami Yusa, Ibaraki, JP;
Satoyuki Nomura, Ibaraki, JP;
Hiroshi Ono, Ibaraki, JP;
Itsuo Watanabe, Ibaraki, JP;
Motohiro Arifuku, Ibaraki, JP;
Hoko Kanazawa, Ibaraki, JP;
Hitachi Chemical Company, Ltd., Tokyo, JP;
Abstract
The present invention provides a wiring-connecting material comprising from 2 to 75 parts by weight of a polyurethane resin, from 30 to 60 parts by weight of a radical-polymerizable substance and from 0.1 to 30 parts by weight of a curing agent capable of generating a free radical upon heating, and a process for producing a wiring-connected board by using the wiring-connecting material. The wiring-connecting material of the present invention may preferably further contain a film-forming material and/or conductive particles.