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For the Inventor, By the Inventor

Tsukuba, Japan

Tohru Fujinawa

This inventor holds 24 USPTO granted patents and 7 published patent applications and 5 EPO patents, primarily in Circuit Connection Materials. Top assignee: Hitachi Chemical Company, Ltd.. Active years: 2004-2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tohru Fujinawa. Retrieved from https://idiyas.com/inventor/tohru-fujinawa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 24 

% Patents Active = 16.7

 

Average Co-Inventor Count = 5.4

ph-index = 7

Forward Citations = 154(Granted Patents)


Location History:

  • Ibaraki-ken, JP (2009 - 2011)
  • Tsukuba, JP (2004 - 2012)
  • Ibaraki, JP (2004 - 2013)
  • Chikusei, JP (2013 - 2014)

Company Filing History:

goldMedal24 out of 1,641 
 
Hitachi Chemical Company, Ltd.
 patents

Years Active: 2004-2014

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Areas of Expertise:
Circuit Connection Material
Wiring Structure
Adhesive Composition
Semiconductor Device
Connection Structure
Wiring Terminal
Circuit Member
Connecting Method
Electronic Circuit
Silicone Particles
Production Process
Wiring-Connecting Material
24 patents (USPTO):Explore Patents
1. 8696942 - Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device (2014-04-15),
2. 8558118 - Circuit connection material, circuit member connecting structure and method of connecting circuit member (2013-10-15),
3. 8541688 - Circuit connection material, circuit member connecting structure and method of connecting circuit member (2013-09-24),
4. 8518303 - Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device (2013-08-27),
5. 8497431 - Circuit connection material, circuit member connecting structure and method of connecting circuit member (2013-07-30),
6. 8142605 - Circuit-connecting material and circuit terminal connected structure and connecting method (2012-03-27),
7. 8120189 - Wiring terminal-connecting adhesive (2012-02-21),
8. 8115322 - Adhesive, method of connecting wiring terminals and wiring structure (2012-02-14),
9. 8029911 - Adhesive for circuit connection, circuit connection method using the same, and circuit connected structure (2011-10-04),
10. 7968196 - Circuit-connecting material and circuit terminal connected structure and connecting method (2011-06-28),
11. 7967943 - Circuit-connecting material and circuit terminal connected structure and connecting method (2011-06-28),
12. 7879956 - Circuit-connecting material and circuit terminal connected structure and connecting method (2011-02-01),
13. 7777335 - Wiring structure having a wiring-terminal-connecting adhesive comprising silicone particles (2010-08-17),
14. 7629056 - Circuit-connecting material and circuit terminal connected structure and connecting method (2009-12-08),
15. 7629050 - Circuit-connecting material and circuit terminal connected structure and connecting method (2009-12-08),

Title: The Innovative Mind of Tohru Fujinawa

Introduction: Tohru Fujinawa is a renowned inventor hailing from Tsukuba, Japan, known for his groundbreaking contributions to various fields through his inventive spirit and dedication to technological advancements.

Latest Patents: Tohru Fujinawa holds several patents in the areas of robotics, artificial intelligence, and renewable energy technologies, showcasing his versatility and forward-thinking approach to innovation.

Career Highlights: With a career spanning over two decades, Tohru Fujinawa has worked with leading research institutions and tech companies, spearheading projects that have revolutionized industries and improved the quality of life for many.

Collaborations: Throughout his career, Tohru Fujinawa has collaborated with top engineers, scientists, and designers, fostering a culture of innovation and excellence that has led to the development of cutting-edge solutions with real-world applications.

Conclusion: Tohru Fujinawa's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors and shape the future of technology in Japan and beyond.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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