The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 31, 2006
Filed:
Dec. 15, 2004
An-hong Liu, Tainan, TW;
Yeong-her Wang, Tainan, TW;
Yeong-ching Chao, Taichung, TW;
Yao-jung Lee, Tainan, TW;
An-Hong Liu, Tainan, TW;
Yeong-Her Wang, Tainan, TW;
Yeong-Ching Chao, Taichung, TW;
Yao-Jung Lee, Tainan, TW;
ChipMOS Technologies (Bermuda) Ltd., Hamilton, BM;
ChipMOS Technologies Inc., Hsinchu, TW;
Abstract
A modularized probe head assembly mainly includes a probe head, an interposer and a probe head carrier with guide pins. The probe head has a plurality of first through holes. The interposer has a plurality of second through holes corresponding in location to the first through holes. The probe head carrier is configured to secure the PCB of a probe card and jointing the probe head with the interposer. A via is formed under a pad on the interposer. A plurality of stud bumps are formed on the pad. After assembling of the probe card, the guide pins pass through the first and second through holes and the stud bumps electrically contact the interconnect pad of the probe head.