The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2006
Filed:
Aug. 12, 2005
Applicants:
Jiangqi He, Gilbert, AZ (US);
Ping Sun, Gilbert, AZ (US);
Hyunjun Kim, Chandler, AZ (US);
Xiang Yin Zeng, Shanghai, CN;
Inventors:
Jiangqi He, Gilbert, AZ (US);
Ping Sun, Gilbert, AZ (US);
Hyunjun Kim, Chandler, AZ (US);
Xiang Yin Zeng, Shanghai, CN;
Assignee:
Intel Corporation, Santa Clara, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/228 (2006.01);
U.S. Cl.
CPC ...
Abstract
Extending high k material of a second dielectric layer to surround at least one thru-via designed to provide a signal other than a power signal to a die may eliminate discrete AC coupling capacitors to reduce cost and improve performance of the package.