The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 19, 2006
Filed:
Feb. 27, 2004
Haruhito Ono, Kanagawa, JP;
Masatake Akaike, Kanagawa, JP;
Kenji Tamamori, Kanagawa, JP;
Futoshi Hirose, Kanagawa, JP;
Yasushi Koyama, Kanagawa, JP;
Atsunori Terasaki, Tokyo, JP;
Ken-ichi Nagae, Kanagawa, JP;
Yoshinori Nakayama, Tokyo, JP;
Haruhito Ono, Kanagawa, JP;
Masatake Akaike, Kanagawa, JP;
Kenji Tamamori, Kanagawa, JP;
Futoshi Hirose, Kanagawa, JP;
Yasushi Koyama, Kanagawa, JP;
Atsunori Terasaki, Tokyo, JP;
Ken-ichi Nagae, Kanagawa, JP;
Yoshinori Nakayama, Tokyo, JP;
Canon Kabushiki Kaisha, Tokyo, JP;
Hitachi High-Technologies Corporation, Tokyo, JP;
Abstract
A deflector which makes multilayered wiring possible and prevents contamination during the manufacture includes an electrode substrate () having a plurality of through holes, and an electrode pair made up of first and second electrodes which oppose the side walls of each through hole in order to control the locus of a charged particle beam passing through the through hole, and a wiring substrate () having connection wiring pads connected to the electrode pairs of the electrode substrate to individually apply voltages to the electrode pairs. This deflector is formed by bonding the electrode substrate and wiring substrate via the connection wiring pads of the wiring substrate.