The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2006
Filed:
Jul. 14, 2003
Kazuto Hirokawa, Tokyo, JP;
Yoichi Kobayashi, Tokyo, JP;
Shunsuke Nakai, Tokyo, JP;
Shinro Ohta, Tokyo, JP;
Yasuo Tsukuda, Osaka, JP;
Kazuto Hirokawa, Tokyo, JP;
Yoichi Kobayashi, Tokyo, JP;
Shunsuke Nakai, Tokyo, JP;
Shinro Ohta, Tokyo, JP;
Yasuo Tsukuda, Osaka, JP;
Ebara Corporation, Tokyo, JP;
Shimadzu Corporation, Kyoto, JP;
Abstract
A substrate polishing apparatus polishes a substrate such as a semiconductor wafer to a flat mirror finish. The substrate polishing apparatus has a polishing table against which a substrate is pressed and a light-emitting and light-receiving device to emit measurement light from the polishing table to the substrate and to receive reflected light from the substrate for measuring a film on the substrate. The substrate polishing apparatus also has a fluid supply passage for supplying a fluid for measurement, through which the measurement light and the reflected light pass, to a fluid chamber provided at a light-emitting and light-receiving position of the polishing table, and a fluid supply control device for controlling supply of the fluid for measurement to the fluid chamber.