The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2006
Filed:
Mar. 04, 2003
Jonathan D. Reid, Sherwood, OR (US);
Steven T. Mayer, Lake Oswego, OR (US);
Seshasayee Varadarajan, Wilsonville, OR (US);
David C. Smith, Lake Oswego, OR (US);
Evan E. Patton, Portland, OR (US);
Dinesh S. Kalakkad, Portland, OR (US);
Gary Lind, Penn Valley, CA (US);
Richard S. Hill, Atherton, CA (US);
Jonathan D. Reid, Sherwood, OR (US);
Steven T. Mayer, Lake Oswego, OR (US);
Seshasayee Varadarajan, Wilsonville, OR (US);
David C. Smith, Lake Oswego, OR (US);
Evan E. Patton, Portland, OR (US);
Dinesh S. Kalakkad, Portland, OR (US);
Gary Lind, Penn Valley, CA (US);
Richard S. Hill, Atherton, CA (US);
Novellus Systems, Inc., San Jose, unknown;
Abstract
The orientation of a wafer with respect to the surface of an electrolyte is controlled during an electroplating process. The wafer is delivered to an electrolyte bath along a trajectory normal to the surface of the electrolyte. Along this trajectory, the wafer is angled before entry into the electrolyte for angled immersion. A wafer can be plated in an angled orientation or not, depending on what is optimal for a given situation. Also, in some designs, the wafer's orientation can be adjusted actively during immersion or during electroplating, providing flexibility in various electroplating scenarios.