The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 15, 2006

Filed:

Jun. 04, 2004
Applicants:

Ian W. Wylie, Naperville, IL (US);

Heinz H. Busta, Park Ridge, IL (US);

David J. Schroeder, Aurora, IL (US);

J. Scott Steckenrider, Plainfield, IL (US);

Yuchun Wang, Naperville, IL (US);

Inventors:

Ian W. Wylie, Naperville, IL (US);

Heinz H. Busta, Park Ridge, IL (US);

David J. Schroeder, Aurora, IL (US);

J. Scott Steckenrider, Plainfield, IL (US);

Yuchun Wang, Naperville, IL (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
Abstract

A three-dimensional integrated circuit that provides reduced interconnect signal delay over known 2-dimensional systems. The three-dimensional integrated circuit also allows improved circuit cooling. The three-dimensional integrated circuit includes two or more electrically connected integrated circuits, separated by a cooling channel.


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