The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 01, 2006
Filed:
May. 28, 2004
Katsuya Okumura, Tokyo-To, JP;
Koji Maruyama, Nirasaki, JP;
Kazuya Nagaseki, Nirasaki, JP;
Akiteru Rai, Nara, JP;
Katsuya Okumura, Tokyo-To, JP;
Koji Maruyama, Nirasaki, JP;
Kazuya Nagaseki, Nirasaki, JP;
Akiteru Rai, Nara, JP;
Octec Inc., Tokyo-To, JP;
Tokyo Electron Limited, Tokyo-To, JP;
Sharp Kabushiki Kaisha, Osaka-Fu, JP;
Ibiden Co., Ltd., Gifu-Ken, JP;
Abstract
The present invention relates to a semiconductor device in which an electrode of a device formed on a substrate such as a semiconductor wafer and an electrode of a wiring structure such as an interposer are connected to each other through a connecting electrode extending through the substrate, and a method of manufacturing the same. A semiconductor device according to the present invention includes a first substrate including a front surface and a back surface, a first device having a first electrode being formed on the front surface; and a wiring structure formed with a second electrode, the wiring structure having a principal surface. The first electrode of the first device and the second electrode of the wiring structure are connected to each other by a connecting electrode extending through the first substrate from the front surface to the back surface thereof. Substantially all the back surface of the first substrate is bonded to the principal surface of the wiring structure. A dielectric film formed between the first substrate and the wiring structure may be an adhesive layer.