The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 2006
Filed:
Sep. 07, 2004
Cher Khng Victor Tan, Singapore, SG;
Choon Kuan Lee, Singapore, SG;
Kian Chai Lee, Singapore, SG;
Guek Har Lim, Singapore, SG;
Wuu Yean Tay, Singapore, SG;
Teck Huat Poh, Singapore, SG;
Cheng Poh Pour, Singapore, SG;
Cher Khng Victor Tan, Singapore, SG;
Choon Kuan Lee, Singapore, SG;
Kian Chai Lee, Singapore, SG;
Guek Har Lim, Singapore, SG;
Wuu Yean Tay, Singapore, SG;
Teck Huat Poh, Singapore, SG;
Cheng Poh Pour, Singapore, SG;
Micron Technology, Inc., Boise, ID (US);
Abstract
A solder mask for use on a carrier substrate includes a device-securing region positionable over at least a portion of a die-support location of the carrier substrate. Dams of the solder mask are positionable laterally adjacent to at least portions of the peripheries of corresponding terminals of the carrier substrate. A carrier substrate includes at least one die-attach location and one or more terminals that protrude from a surface of the carrier substrate so as to prevent adhesive material from contaminating connection surfaces thereof. The solder may be positioned or formed on the carrier substrate. The carrier substrate and solder mask may each include one or more recessed areas that laterally surround at least portions of their die-attach location and device-securing region, respectively, to receive excess adhesive.