The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 2006
Filed:
Oct. 10, 2003
Applicants:
Young-gon Kim, Cupertino, CA (US);
David Gibson, Lake Oswego, OR (US);
Michael Warner, San Jose, CA (US);
Philip Damberg, Cupertino, CA (US);
Philip Osborn, Mountain View, CA (US);
Inventors:
Young-Gon Kim, Cupertino, CA (US);
David Gibson, Lake Oswego, OR (US);
Michael Warner, San Jose, CA (US);
Philip Damberg, Cupertino, CA (US);
Philip Osborn, Mountain View, CA (US);
Assignee:
Tessera, Inc., San Jose, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract
An ultra thin system-in-a-package (SIP) with independent test and repair capability comprises an interposer having arranged on a top surface and a bottom surface thereof a number of packaged semiconductor chips mounted via solder bumps in accordance with a Land Grid Array (LGA) format and wherein no underfill is used on the SIP.