The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 06, 2006

Filed:

Jul. 30, 2003
Applicants:

Junji Kunisawa, Kanagawa, JP;

Norio Kimura, Kanagawa, JP;

Kenya Ito, Kanagawa, JP;

Akira Fukunaga, Kanagawa, JP;

Yuuki Inoue, Kanagawa, JP;

Hiroshi Tomita, Kanagawa, JP;

Soichi Nadahara, Kanagawa, JP;

Motoyuki Sato, Kanagawa, JP;

Inventors:

Junji Kunisawa, Kanagawa, JP;

Norio Kimura, Kanagawa, JP;

Kenya Ito, Kanagawa, JP;

Akira Fukunaga, Kanagawa, JP;

Yuuki Inoue, Kanagawa, JP;

Hiroshi Tomita, Kanagawa, JP;

Soichi Nadahara, Kanagawa, JP;

Motoyuki Sato, Kanagawa, JP;

Assignee:

Ebara Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B08B 3/08 (2006.01); B25B 11/00 (2006.01); H01L 21/306 (2006.01);
U.S. Cl.
CPC ...
Abstract

A holding unit holds a substrate to enable a surface of the substrate to be processed. The unit has a vacuum suction member that comes into contact with a peripheral portion of the surface of the substrate and sucks the substrate. A processing apparatus holds the wafer stably and allows an edge, a bevel portion and/or a back surface of the wafer to be processed.


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