The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 16, 2006
Filed:
Jan. 08, 2003
Applicants:
Hideyuki Hirakoso, Yokohama, JP;
Masayuki Ishikawa, Sanda, JP;
Akio Yanagisawa, Naka-gun, JP;
Katsumi Ogi, Minami-saitama-gun, JP;
Inventors:
Hideyuki Hirakoso, Yokohama, JP;
Masayuki Ishikawa, Sanda, JP;
Akio Yanagisawa, Naka-gun, JP;
Katsumi Ogi, Minami-saitama-gun, JP;
Assignee:
Mitsubishi Materials Corporation, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
C07F 17/02 (2006.01); C23C 16/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
Bis(cyclopentadienyl)ruthenium complex havimg a content of at least one member selected from among sodium, potassium, calcium, iron, nickel and zinc of 5 ppm or below; and bis(cyclopentadienyl)ruthenium complex incorporated with 10 to 100 ppm of rhenium The complexes are suitable for metalorganic chemical vapor deposition (MOCVD) and can give ruthenium-containing thin film.