The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 09, 2006
Filed:
Jun. 28, 2002
Sridharan Srivatsan, Sunnyvale, CA (US);
Ramesh Gopalan, Fremont, CA (US);
K. Y. Ramanujam, Fremont, CA (US);
Sridharan Srivatsan, Sunnyvale, CA (US);
Ramesh Gopalan, Fremont, CA (US);
K. Y. Ramanujam, Fremont, CA (US);
Lam Research Corporation, Fremont, CA (US);
Abstract
A method for preventing de-lamination of semiconductor wafer film stacks during a linear belt-type chemical mechanical planarization (CMP) process is provided. The method implements a pulsed polishing head rotation during a CMP process to maintain a slurry distribution across the width of a belt pad. The slurry distribution is maintained in a manner that prevents de-lamination of a wafer film having weak adhesion characteristics. Thus, the pulsed polishing head rotation implemented by the method reduces de-lamination of low-K material film layers during the CMP process.