The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 2006
Filed:
Dec. 22, 2003
Chun-li Chou, Shinjhuang, TW;
Yih-ann Lin, Taipei, TW;
Yi-chen Huang, Hsin-Chu, TW;
Chao-cheng Chen, Chong-Lin, TW;
Hun-jan Tao, Hsinchu, TW;
Chun-Li Chou, Shinjhuang, TW;
Yih-Ann Lin, Taipei, TW;
Yi-Chen Huang, Hsin-Chu, TW;
Chao-Cheng Chen, Chong-Lin, TW;
Hun-Jan Tao, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Company, Hsin-Chu, TW;
Abstract
A method for cleaning semiconductor substrates includes a DI water clean operation that uses a spin speed no greater than 350 rpm. The cleaning method may include additional cleaning operations such as an organic clean, an aqueous chemical clean or a DI water/ozone clean. The cleaning method may be used to clean substrates after the conclusion of an etching procedure which exposes a single film between a Cu-containing conductive material and the environment. The spin speed of the DI water clean operation prevents copper corrosion due to breakdown of the film that separates the Cu-containing conductive material from the environment.