The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 14, 2006

Filed:

Jul. 11, 2003
Applicants:

Adhiveeraraghavan Srikanth, Folsom, CA (US);

Navneet Dour, Fair Oaks, CA (US);

Inventors:

Adhiveeraraghavan Srikanth, Folsom, CA (US);

Navneet Dour, Fair Oaks, CA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03B 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

In one embodiment, a pre-driver generates pre-driving signals based on control signals provided by a control circuit. The pre-driver has pre-driver power and ground connections. The pre-driving signals operate at a frequency band. A driver generates an output signal based on the pre-driving signals at an output pad. The output signal has a slew rate. The driver has driver power and ground connections. A low pass filter is coupled between the pre-driver and the driver power and ground connections to reduce the effect of noise at the pre-driving signals. The low pass filter has a cut-off frequency corresponding to the frequency of noise. In another embodiment, a plurality of pre-drivers generates pre-driving signals based on control signals provided by a control circuit. The pre-drivers have pre-driver power and ground connections. A plurality of drivers generates a plurality of output signals based on the pre-driving signals at output pads of an integrated circuit. Each of the output signals has a slew rate. The drivers have driver power and ground connections. On-die pre-driver power and ground planes are coupled to the pre-driver power and ground connections on die of the integrated circuit, respectively. On-die driver power and ground planes are coupled to the driver power and ground connections on-die of the integrated circuit, respectively. The driver power and ground planes are separated from the pre-driver power and ground planes on the die, and/or on the package to maintain the desired slew rate.


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