The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7012007 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 14, 2006

Filed:

Sep. 09, 2003
Applicants:

Jung-suk Goo, Stanford, CA (US);

Qi Xiang, San Jose, CA (US);

James Pan, Santa Clara, CA (US);

Inventors:

Jung-Suk Goo, Stanford, CA (US);

Qi Xiang, San Jose, CA (US);

James Pan, Santa Clara, CA (US);

Assignee:

Advanced Micro Device, Inc., Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/336 (2006.01);
U.S. Cl.
CPC ...
Abstract

A strained silicon MOSFET employs a high thermal conductivity insulating material in the trench isolations to dissipate thermal energy generated in the MOSFET and to avoid self-heating caused by the poor thermal conductivity of an underlying silicon germanium layer. The high thermal conductivity material is preferably silicon carbide, and the isolations preferably extend through the silicon germanium layer to contact an underlying silicon layer so as to conduct thermal energy from the active region to the silicon layer.


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Goo, Jung-Suk. (2006). Strained silicon mosfet having improved thermal conductivity and method for its fabrication (U.S. Patent No. 7012007). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7012007

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