The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 24, 2006
Filed:
Feb. 23, 2004
Shyng-tsong Chen, Patterson, NY (US);
Kenneth P. Rodbell, Sandy Hook, CT (US);
Oscar Kai Chi Hsu, Chelmsford, MA (US);
Jean Vangsness, Stow, MA (US);
David S. Gilbride, Lowell, MA (US);
Scott Clayton Billings, Kingston, NH (US);
Kenneth Davis, Newburgh, NY (US);
Shyng-Tsong Chen, Patterson, NY (US);
Kenneth P. Rodbell, Sandy Hook, CT (US);
Oscar Kai Chi Hsu, Chelmsford, MA (US);
Jean Vangsness, Stow, MA (US);
David S. Gilbride, Lowell, MA (US);
Scott Clayton Billings, Kingston, NH (US);
Kenneth Davis, Newburgh, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method of making a polishing pad having a body comprising fibers embedded in a matrix polymer formed by a reaction of polymer precursors. The fibers define interstices, and the precursors fill these interstices substantially completely before completion of the reaction. The method comprising placing the fibers and the precursors in a cavity of a mold for shaping the polishing pad; applying a differential pressure across a mold cavity, where the differential pressure and the amount of precursors are sufficient to cause the precursors to fill the interstices substantially completely before completion of the reaction; and applying sufficient heat to the mold to at least partially cure the polishing pad by causing the precursors to react.