The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 27, 2005
Filed:
Nov. 15, 2002
Takayuki Niuya, Tokyo-To, JP;
Takehiko Orii, Nirasaki, JP;
Hiroyuki Mori, Nirasaki, JP;
Hiroshi Yano, Nirasaki, JP;
Mitsunori Nakamori, Nirasaki, JP;
Takayuki Niuya, Tokyo-To, JP;
Takehiko Orii, Nirasaki, JP;
Hiroyuki Mori, Nirasaki, JP;
Hiroshi Yano, Nirasaki, JP;
Mitsunori Nakamori, Nirasaki, JP;
Tokyo Electron Limited, Tokyo-To, JP;
Abstract
A resist film and a polymer layer adhered on a semiconductor substrate can be removed by the method according to the present invention. A first processing liquid, typically including a oxidizing agent, such as hydrogen peroxide solution, is fed to the substrate, thereby the condition of the resist film and the polymer layer is changed. Next, a second processing liquid, typically including a dimethyl sulfoxide and an amine solvent, is fed to the substrate, thereby the resist film and the polymer layer is dissolved and lifted off from the substrate. A sputtered copper particles included in the polymer layer can also be removed.