The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 2005
Filed:
Jan. 12, 2004
Emmanuil H. Lingunis, San Jose, CA (US);
Nga-ching Alan Wong, San Jose, CA (US);
Sameer Haddad, San Jose, CA (US);
Mark W. Randolph, San Jose, CA (US);
Mark T. Ramsbey, Sunnyvale, CA (US);
Ashot Melik-martirosian, Santa Clara, CA (US);
Edward F. Runnion, Santa Clara, CA (US);
Yi He, Fremont, CA (US);
Emmanuil H. Lingunis, San Jose, CA (US);
Nga-Ching Alan Wong, San Jose, CA (US);
Sameer Haddad, San Jose, CA (US);
Mark W. Randolph, San Jose, CA (US);
Mark T. Ramsbey, Sunnyvale, CA (US);
Ashot Melik-Martirosian, Santa Clara, CA (US);
Edward F. Runnion, Santa Clara, CA (US);
Yi He, Fremont, CA (US);
Advanced Micro Devices, Inc., Sunnyvale, CA (US);
Abstract
A technique for forming at least part of an array of a dual bit memory core is disclosed. Initially, a portion of a charge trapping dielectric layer is formed over a substrate and a resist is formed over the portion of the charge trapping dielectric layer. The resist is patterned and a pocket implant is performed at an angle to establish pocket implants within the substrate. A bitline implant is then performed to establish buried bitlines within the substrate. The patterned resist is then removed and the remainder of the charge trapping dielectric layer is formed. A wordline material is formed over the remainder of the charge trapping dielectric layer and patterned to form wordlines that overlie the bitlines. The pocket implants serve to mitigate, among other things, complementary bit disturb (CBD) that can result from semiconductor scaling. As such, semiconductor devices can be made smaller and increased packing densities can be achieved by virtue of the inventive concepts set forth herein.