The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2005
Filed:
Oct. 28, 2003
Jau-shoung Chen, Jubei, TW;
Su Tao, Kaohsiung, TW;
Jau-Shoung Chen, Jubei, TW;
Su Tao, Kaohsiung, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
A bumping process, which is a method of forming a plurality of bumps over a wafer, is provided. The wafer has an active surface having a passivation layer and a plurality of bonding pads thereon. The passivation layer exposes the bonding pads on the active surface. An adhesion layer is formed over the active surface of the wafer covering both the bonding pads and the passivation layer. A metallic layer is formed over the adhesion layer. The adhesion layer and the metallic layer are patterned, so that the adhesion layer and the metallic layer remain on top of the bonding pads. A photoresist layer is formed on the active surface of the wafer. The photoresist layer has a plurality of openings that exposes the metallic layer. Next, solder balls with a solidified material on the surface of each solder ball are disposed into each opening. Then, a reflow process is carried out, so that the solder balls bond with the metallic layer. Finally, the photoresist layer is removed.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile