The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2005
Filed:
Apr. 10, 2003
Makoto Ono, Yokohama, JP;
Yohei Asakawa, Yokohama, JP;
Hisafumi Iwata, Hayama, JP;
Kanako Harada, Yokohama, JP;
Makoto Ono, Yokohama, JP;
Yohei Asakawa, Yokohama, JP;
Hisafumi Iwata, Hayama, JP;
Kanako Harada, Yokohama, JP;
Hitachi High-Technologies Corporation, Tokyo, JP;
Abstract
A program is provided for setting efficiently, and with precision, the inspection conditions of an inspection device that detects particles and deformed patterns in or on products such as semiconductor integrated circuits that are manufactured by simultaneously forming a plurality of products on a single substrate. In particular, the system achieves greater efficiency of the setting of cell comparison regions and the setting of non-inspection regions. Input processing of a product type code, input processing of chip size and configuration information, reading processing of circuit layout data, extraction processing of repeated pattern region coordinates, extraction processing of sparse region coordinates and circuit pattern condition registration processing are sequentially executed.