The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2005
Filed:
Nov. 12, 2003
Tae-min Eom, Sungnam, KR;
Yu-sin Yang, Seoul, KR;
Kwan-woo Ryu, Suwon, KR;
Park-song Kim, Gwangju, KR;
Sang-mun Chon, Yongin, KR;
Sun-yong Choi, Sungnam, KR;
Chung-sam Jun, Suwon, KR;
Tae-Min Eom, Sungnam, KR;
Yu-Sin Yang, Seoul, KR;
Kwan-Woo Ryu, Suwon, KR;
Park-Song Kim, Gwangju, KR;
Sang-Mun Chon, Yongin, KR;
Sun-Yong Choi, Sungnam, KR;
Chung-Sam Jun, Suwon, KR;
Samsung Electronics Co., Ltd., Kyungki-do, KR;
Abstract
An apparatus for measuring contamination of a semiconductor substrate includes a chuck for loading a substrate, a position detection means for recognizing a front surface of the loaded substrate to obtain position data of a portion of the substrate to be measured, a first driving part for moving the chuck in accordance with the position data to measure a rear portion of the substrate, and a surface measurement means disposed under the chuck for selectively measuring metal contamination of the substrate at the rear portion of the substrate. In operation, the substrate is loaded onto a chuck, position data of a portion of the substrate to be measured is obtained by recognizing patterns formed on the substrate, the substrate is then moved in accordance with the position data to measure a rear portion of the substrate, and metal contamination is selectively measured at the rear portion of the substrate.