The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2005
Filed:
Aug. 21, 2001
Gaku Minamihaba, Kawasaki, JP;
Hiroyuki Yano, Yokohama, JP;
Nobuyuki Kurashima, Yokohama, JP;
Nobuo Kawahashi, Yokkaichi, JP;
Masayuki Hattori, Aichi-ken, JP;
Kazuo Nishimoto, Yokkaichi, JP;
Gaku Minamihaba, Kawasaki, JP;
Hiroyuki Yano, Yokohama, JP;
Nobuyuki Kurashima, Yokohama, JP;
Nobuo Kawahashi, Yokkaichi, JP;
Masayuki Hattori, Aichi-ken, JP;
Kazuo Nishimoto, Yokkaichi, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
JSR Corporation, Tokyo, JP;
Abstract
A method of manufacturing a semiconductor device uses a slurry for chemical polishing during the manufacturing process, the slurry containing polishing particles comprising colloidal particles whose primary particles have a diameter ranging from 5 to 30 nm, wherein the degree of association of the primary particles is 5 or less. This slurry for chemical mechanical polishing makes it possible to minimize erosion and scratching whenever a conductive material film is subjected to CMP treatment.