The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2005
Filed:
Feb. 13, 2001
Stephen L. Buchwalter, Hopewell Junction, NY (US);
David Danovitch, Granby, CA;
Fuad Elias Doany, Katonah, NY (US);
Claudius Feger, Poughkeepsie, NY (US);
Peter A. Gruber, Mohegan Lake, NY (US);
Revathi Iyengar, Cortlandt Manor, NY (US);
Nancy C. Labianca, Yalesville, CT (US);
Stephen L. Buchwalter, Hopewell Junction, NY (US);
David Danovitch, Granby, CA;
Fuad Elias Doany, Katonah, NY (US);
Claudius Feger, Poughkeepsie, NY (US);
Peter A. Gruber, Mohegan Lake, NY (US);
Revathi Iyengar, Cortlandt Manor, NY (US);
Nancy C. LaBianca, Yalesville, CT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Methods for fabricating microelectronic interconnection structures as well as the structures formed by the methods are disclosed which improve the manufacturing throughput for assembling flip chip semiconductor devices. The use of a bilayer of polymeric materials applied on the wafer prior to dicing eliminates the need for dispensing and curing underfill for each semiconductor at the package level, thereby improving manufacturing throughput and reducing cost.