The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 26, 2005

Filed:

Jul. 03, 2003
Applicants:

Wenling Wang, Shiroyama-Machi, JP;

Koichi Sakamoto, Shiroyama-Machi, JP;

Fujio Suzuki, Shiroyama-Machi, JP;

Takashi Yokota, Shiroyama-Machi, JP;

Inventors:

Wenling Wang, Shiroyama-Machi, JP;

Koichi Sakamoto, Shiroyama-Machi, JP;

Fujio Suzuki, Shiroyama-Machi, JP;

Takashi Yokota, Shiroyama-Machi, JP;

Assignee:

Tokyo Electron Limited, Tokyo-To, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05B001/02 ;
U.S. Cl.
CPC ...
Abstract

A heat treatment apparatus has a controller () provided with a temperature estimator () for estimating a temperature of a wafer by detection signals of temperature sensors (Sin, Sout) and a temperature calibrator () for correcting the estimated temperature of the wafer. In order to calibrate the temperature, an offset value stored in an offset table () is used. The offset value is determined based on the relationship between film-thickness of films formed in an experimental heat treatment process and process temperatures.


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Wang, Wenling. (2005). Heat treatment apparatus, calibration method for temperature measuring system of the apparatus, and heat treatment system (U.S. Patent No. 6922522). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6922522

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