The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2005
Filed:
Feb. 27, 2003
Applicants:
Qianqiu YE, Wilmington, DE (US);
Matthew Vanhanehem, Bear, DE (US);
John Quanci, Haddonfield, NJ (US);
Inventors:
Qianqiu Ye, Wilmington, DE (US);
Matthew VanHanehem, Bear, DE (US);
John Quanci, Haddonfield, NJ (US);
Assignee:
Rohm and Haas Electronic Materials CMP Holdings, Inc., Wilmington, DE (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L021/302 ; B24B001/00 ; C09K001/68 ;
U.S. Cl.
CPC ...
Abstract
An aqueous slurry is useful for chemical mechanical planarizing a semiconductor substrate. The slurry includes by weight percent, 0.1 to 25 oxidizing agent, 0.1 to 20 silica particles having an average particle size of less than 200 nm, 0.005 to 0.8 polyvinyl pyrrolidone for coating the silica particles, 0.01 to 10 inhibitor, 0.001 to 10 complexing agent and a balance water and incidental impurities; and the aqueous slurry having a pH of at least 7.