The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 24, 2005

Filed:

Mar. 29, 2002
Applicants:

Xuyen Pham, Fremont, CA (US);

Tuan Nguyen, San Jose, CA (US);

Ren Zhou, Fremont, CA (US);

David Wei, Fremont, CA (US);

Linda Jiang, Milpitas, CA (US);

Katgenhalli Y. Ramanujam, Fremont, CA (US);

Joseph P. Simon, Newark, CA (US);

Tony Luong, San Jose, CA (US);

Sridharan Srivatsan, Sunnyvale, CA (US);

Anjun Jerry Jin, Milpitas, CA (US);

Inventors:

Xuyen Pham, Fremont, CA (US);

Tuan Nguyen, San Jose, CA (US);

Ren Zhou, Fremont, CA (US);

David Wei, Fremont, CA (US);

Linda Jiang, Milpitas, CA (US);

Katgenhalli Y. Ramanujam, Fremont, CA (US);

Joseph P. Simon, Newark, CA (US);

Tony Luong, San Jose, CA (US);

Sridharan Srivatsan, Sunnyvale, CA (US);

Anjun Jerry Jin, Milpitas, CA (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B049/00 ;
U.S. Cl.
CPC ...
Abstract

A temperature controlling system for use in a chemical mechanical planarization (CMP) system having a linear polishing belt, a carrier capable of applying a substrate over a preparation location over the linear polishing belt is provided. The temperature controlling system includes a platen having a plurality of zones. The temperature controlling system further includes a temperature sensor configured determine a temperature of the linear polishing belt at a location that is after the preparation location. The system also includes a controller for adjusting a flow of temperature conditioned fluid to selected zones of the plurality of zones of the platen in response to output received from the temperature sensor.


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