The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2005
Filed:
Jan. 11, 2002
Philip Damberg, Cupertino, CA (US);
Craig S. Mitchell, San Jose, CA (US);
John B. Riley, Dallas, TX (US);
Michael Warner, San Jose, CA (US);
Joseph Fjelstad, Maple Valley, WA (US);
Philip Damberg, Cupertino, CA (US);
Craig S. Mitchell, San Jose, CA (US);
John B. Riley, Dallas, TX (US);
Michael Warner, San Jose, CA (US);
Joseph Fjelstad, Maple Valley, WA (US);
Tessera, Inc., San Jose, CA (US);
Abstract
A stacked microelectronic assembly includes a dielectric element and a first and second microelectronic element stacked one atop the other with the first microelectronic element disposed between the second microelectronic element and the dielectric. The dielectric element has opposed first and second surfaces with conductive features exposed at the first surface and terminals exposed on the second surface. Preferably, the contact-bearing face of the first microelectronic element confronts the first surface of the dielectric with at least some of the conductive features being movable with respect to the contacts or terminals. By providing such movable features, joining units have heights of about 300 microns or less may be joined to the terminals thereby reducing the overall height of the microelectronic assembly to 1.2 mm and less.