The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 26, 2005

Filed:

Aug. 01, 2003
Applicants:

Vuong P. Nguyen, Allen, TX (US);

Richard E. Sims, DeSoto, TX (US);

Xiaoguang Zhu, Plano, TX (US);

Inventors:

Vuong P. Nguyen, Allen, TX (US);

Richard E. Sims, DeSoto, TX (US);

Xiaoguang Zhu, Plano, TX (US);

Assignee:

FSI International, Inc., Chaska, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F27D001/18 ;
U.S. Cl.
CPC ...
Abstract

Methods and apparatuses to improve the temperature uniformity of a workpiece being processed on a heated platen of a thermal processing station. A heated platen is enclosed in a housing incorporating an additional heat source that uniformly outputs thermal energy into the process chamber in which the heated platen is positioned. In preferred embodiments, this heat source is positioned in the lid of the housing. It is additionally preferred that the heated lid includes features that provide a gas flow path to introduce to and/or purge gas from the process chamber. In terms of photoresist performance, the improved thermal uniformity provided by using such an additional heat source in the housing, e.g., in the lid, offers improved line width control and line uniformity across a wafer.

Published as:
US2004048220A1; WO2004025697A2; AU2003257112A1; AU2003257112A8; TW200414366A; WO2004025697A3; WO2004025697B1; KR20050035300A; US6884066B2; EP1540259A2; CN1682084A; JP2005538564A;

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