The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 2005
Filed:
May. 15, 2002
Jeng-yang Pan, Taipei, TW;
Chin-te Huang, Hsin-Chu, TW;
Chen-yi Huang, Hsin Chu, TW;
Sheng-wen Chen, Taipei, TW;
Jeng-Yang Pan, Taipei, TW;
Chin-Te Huang, Hsin-Chu, TW;
Chen-Yi Huang, Hsin Chu, TW;
Sheng-Wen Chen, Taipei, TW;
Taiwan Semiconductor Manufacturing Co, Ltd., Hsin Chu, TW;
Abstract
A method and system for reducing wafer edge residue following a chemical mechanical polishing operation. A semiconductor wafer can be polished utilizing a chemical mechanical polishing apparatus. Thereafter, an acid etch operation may be performed to remove a residue, such as tungsten (W), collected on the semiconductor wafer as a result of the chemical mechanical polishing operation. A spin etch operation removes residue from the edges of the semiconductor wafer following chemical mechanical polishing of the semiconductor wafer.