The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 05, 2005

Filed:

Feb. 27, 2003
Applicants:

James M. Hannan, Portland, OR (US);

John J. Harsany, Aloha, OR (US);

James R. Jordan, St. Helens, OR (US);

Phillip W. Sheeley, Hillsboro, OR (US);

Inventors:

James M. Hannan, Portland, OR (US);

John J. Harsany, Aloha, OR (US);

James R. Jordan, St. Helens, OR (US);

Phillip W. Sheeley, Hillsboro, OR (US);

Assignee:

Credence Systems Corporation, Milpitas, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R031/02 ;
U.S. Cl.
CPC ...
Abstract

Apparatus for testing semiconductor integrated circuit devices in wafer form includes a test head, a probe card support mechanism attached to the test head for supporting a probe card beneath the test head, a wafer prober for presenting successive wafers to be tested to the test head from beneath the test head, and a lifting mechanism attached to the wafer prober for lifting the test head above the wafer prober. Upon lifting the test head above the wafer prober, the probe card support mechanism can move horizontally relative to the test head between an inserted position in which the probe card support mechanism is positioned to enable the probe card to engage contact elements of the test head and an extended position in which the probe card can be removed from the probe card support mechanism.


Find Patent Forward Citations

Loading…