The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2005
Filed:
Nov. 30, 2001
Mitsuaki Katagiri, Nishitokyo, JP;
Yuji Shirai, Hamura, JP;
Kunihiko Nishi, Kokubunji, JP;
Takehiro Ohnishi, Higashimurayama, JP;
Mitsuaki Katagiri, Nishitokyo, JP;
Yuji Shirai, Hamura, JP;
Kunihiko Nishi, Kokubunji, JP;
Takehiro Ohnishi, Higashimurayama, JP;
Renesas Technology Corp., Tokyo, JP;
Abstract
A semiconductor wafer which has finished formation of a relocating wiring layer thereon is stored and after determination of a design, solder bumps are formed over bump lands (one end of the relocating wiring layer) in accordance with a pattern which differs with a design, whereby a function or characteristic depending on the design is selected. The semiconductor wafer is then cut into a plurality of semiconductor chips, whereby a wafer level CSP is available.