The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2005
Filed:
Dec. 12, 2001
Robert J. Small, Dublin, CA (US);
Maria Peterson, Belmont, CA (US);
Tuan Truong, San Jose, CA (US);
Melvin Keith Carter, Los Gatos, CA (US);
Lily Yao, Newark, CA (US);
Robert J. Small, Dublin, CA (US);
Maria Peterson, Belmont, CA (US);
Tuan Truong, San Jose, CA (US);
Melvin Keith Carter, Los Gatos, CA (US);
Lily Yao, Newark, CA (US);
EKC Technology, Inc., Hayward, CA (US);
Abstract
The present invention relates chemical mechanical planarization ('CMP') of copper surfaces and describes copper CMP slurries including an oxidizer, one or more hydroxylamine compounds and at least one abrasive. The hydroxylamine compositions can include hydroxylamine nitrate, hydroxylamine, hydroxylamine sulfate, hydroxyl ammonium salts and mixtures thereof. The oxidizers may further include citric acid as a complexing agent for copper. Sulfuric acid and/or nitric acid provide means for modifying the pH of the oxidizer so that the hydroxylamine chemistries are acidic. Some embodiments include corrosion inhibitors such as benzotriazole, 2,4-pentadione dioxime and/or 1,6-dioxaspiro[4,4] nonane 2,7-dione. Some embodiments also include a free radical inhibitor, advantageously hydrazine. Colloidal silica and milled alumina are used as typical abrasive components.