The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 08, 2005

Filed:

Jan. 22, 2002
Applicants:

Jiong Chen, San Jose, CA (US);

Jihliang Chen, Saratoga, CA (US);

Jianmin Qiao, Fremont, CA (US);

Inventors:

Jiong Chen, San Jose, CA (US);

Jihliang Chen, Saratoga, CA (US);

Jianmin Qiao, Fremont, CA (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05F023/00 ;
U.S. Cl.
CPC ...
Abstract

A method and system for processing wafers is disclosed. According to one embodiment () a chuck system () may be situated opposite to an input source (). A chuck system () may apply a force (e.g., mechanical and/or electromagnetic) that deforms a substrate (). Once deformed, essentially all of a substrate () may be oriented at a predetermined angle (e.g., 90°) with respect to an input source ().


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