The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2005
Filed:
Apr. 03, 2003
David Angell, Poughkeepsie, NY (US);
Frederic Beaulieu, Granby, CA;
Takashi Hisada, Ritto-cho, JP;
Adreanne Kelly, Poughkeepsie, NY (US);
Samuel Roy Mcknight, New Paltz, NY (US);
Hiromitsu Miyai, Tokyo, JP;
Kevin Shawn Petrarca, Newburgh, NY (US);
Wolfgang Sauter, Richmond, VT (US);
Richard Paul Volant, New Fairfield, CT (US);
Caitlin W. Weinstein, Cambridge, MA (US);
David Angell, Poughkeepsie, NY (US);
Frederic Beaulieu, Granby, CA;
Takashi Hisada, Ritto-cho, JP;
Adreanne Kelly, Poughkeepsie, NY (US);
Samuel Roy McKnight, New Paltz, NY (US);
Hiromitsu Miyai, Tokyo, JP;
Kevin Shawn Petrarca, Newburgh, NY (US);
Wolfgang Sauter, Richmond, VT (US);
Richard Paul Volant, New Fairfield, CT (US);
Caitlin W. Weinstein, Cambridge, MA (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Disclosed is a reinforced bond pad structure having nonplanar dielectric structures and a metallic bond layer conformally formed over the nonplanar dielectric structures. The nonplanar dielectric structures are substantially reproduced in the metallic bond layer so as to form nonplanar metallic structures. Surrounding each of the nonplanar metallic structures is a ring of dielectric material which provides a hard stop during probing of the bond pad so as to limit the amount of bond pad that can be removed during probing.