The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 08, 2005

Filed:

Oct. 02, 2001
Applicants:

Darryl D. Restaino, Modena, NY (US);

Delores Bennett, Poughkeepsie, NY (US);

John A. Fitzsimmons, Poughkeepsie, NY (US);

John Fritche, New Paltz, NY (US);

Jeffrey C. Hedrick, Montvale, NJ (US);

Chih-chien Liu, Fishkill, NY (US);

Shahab Siddiqui, Wappingers Falls, NY (US);

Christy S. Tyberg, Croton-on-Hudson, NY (US);

Inventors:

Darryl D. Restaino, Modena, NY (US);

Delores Bennett, Poughkeepsie, NY (US);

John A. Fitzsimmons, Poughkeepsie, NY (US);

John Fritche, New Paltz, NY (US);

Jeffrey C. Hedrick, Montvale, NJ (US);

Chih-Chien Liu, Fishkill, NY (US);

Shahab Siddiqui, Wappingers Falls, NY (US);

Christy S. Tyberg, Croton-on-Hudson, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L021/311 ;
U.S. Cl.
CPC ...
Abstract

A method for removing a dielectric layer formed upon a semiconductor substrate is disclosed. In an exemplary embodiment of the invention, the method includes subjecting the dielectric layer to a dry etch process and subjecting an adhesion promoter layer underneath the dielectric layer to a wet etch process.


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