The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 22, 2005
Filed:
Nov. 15, 2000
Janine K. Kardokus, Otis Orchards, WA (US);
Chi Tse Wu, Veradale, WA (US);
Christopher L. Parfeniuk, Spokane, WA (US);
Jane E. Buehler, Spokane, WA (US);
Janine K. Kardokus, Otis Orchards, WA (US);
Chi tse Wu, Veradale, WA (US);
Christopher L. Parfeniuk, Spokane, WA (US);
Jane E. Buehler, Spokane, WA (US);
Honeywell International Inc., Morristown, NJ (US);
Abstract
The invention includes a sputtering target containing copper of a purity of at least about 99.999 wt. %, and at least one component selected from the group consisting of Ag, Sn, Te, In, B, Bi, Sb, and P dispersed within the copper. The total of Ag, Sn, Te, In, B, Bi, Sb, and P within the copper is from at least 0.3 ppm to about 10 ppm. The sputtering target has a substantially uniform grain size of less than or equal to about 50 micrometers throughout the copper and the at least one component.