The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2005
Filed:
Jun. 20, 2001
Alfred W. Mak, Union City, CA (US);
Mei Chang, Saratoga, CA (US);
Jeong Soo Byun, Cupertino, CA (US);
Hua Chung, San Jose, CA (US);
Ashok Sinha, Palo Alto, CA (US);
Moris Kori, Palo Alto, CA (US);
Alfred W. Mak, Union City, CA (US);
Mei Chang, Saratoga, CA (US);
Jeong Soo Byun, Cupertino, CA (US);
Hua Chung, San Jose, CA (US);
Ashok Sinha, Palo Alto, CA (US);
Moris Kori, Palo Alto, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
A system and method to form a stacked barrier layer for copper contacts formed on a substrate. The substrate is serially exposed to first and second reactive gases to form an adhesion layer. Then, the adhesion layer is serially exposed to third and fourth reactive gases to form a barrier layer adjacent to the adhesion layer. This is followed by deposition of a copper layer adjacent to the barrier layer.