The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6849540 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 01, 2005

Filed:

Aug. 15, 2001
Applicants:

Tsuneo Terasawa, Ome, JP;

Toshihiko Tanaka, Tokyo, JP;

Ko Miyazaki, Kokubunji, JP;

Norio Hasegawa, Hinode, JP;

Kazutaka Mori, Kokubunji, JP;

Inventors:

Tsuneo Terasawa, Ome, JP;

Toshihiko Tanaka, Tokyo, JP;

Ko Miyazaki, Kokubunji, JP;

Norio Hasegawa, Hinode, JP;

Kazutaka Mori, Kokubunji, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21027 ;
U.S. Cl.
CPC ...
Abstract

Productivity of a semiconductor integrated circuit device is improved. According to how many times the photomask is used, a photomask having an opaque pattern made of metal and a photomask having an opaque pattern made of a resist film are properly used, and thereby an exposure treatment is performed.


Find Patent Forward Citations

Terasawa, Tsuneo. (2005). Method of fabricating semiconductor integrated circuit device and method of producing a multi-chip module that includes patterning with a photomask that uses metal for blocking exposure light and a photomask that uses organic resin for blocking exposure light (U.S. Patent No. 6849540). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6849540

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