The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2005
Filed:
Apr. 24, 2002
Junji Noguchi, Ome, JP;
Naofumi Ohashi, Hanno, JP;
Kenichi Takeda, Tokorozawa, JP;
Tatsuyuki Saito, Ome, JP;
Hizuru Yamaguchi, Akishima, JP;
Nobuo Owada, Ome, JP;
Junji Noguchi, Ome, JP;
Naofumi Ohashi, Hanno, JP;
Kenichi Takeda, Tokorozawa, JP;
Tatsuyuki Saito, Ome, JP;
Hizuru Yamaguchi, Akishima, JP;
Nobuo Owada, Ome, JP;
Renesas Technology Corp., Tokyo, JP;
Abstract
A semiconductor device comprises a semiconductor substrate; a first insulating film overlying a surface of the semiconductor substrate, an upper surface of the first insulating film being nitrided; a first copper-embedded interconnection embedded in the first insulating film, and which first copper-embedded interconnection contains copper as a main component; a copper nitride film overlying an upper surface of the first copper-embedded interconnection; a cap insulating film overlying an upper surface of the first insulating film and an upper surface of the copper nitride film; and a second insulting film overlying the cap insulating film.