The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2005
Filed:
Jan. 29, 2003
Chih-kung Chang, Hsin-Chu, TW;
Yu-kung Hsiao, Tao-Yuan, TW;
Sheng-liang Pan, Hsin-Chu, TW;
Fu-tien Wong, Hsin-Chu, TW;
Chin-chen Kuo, Taipei, TW;
Chung-sheng Hsiung, Hsinchu, TW;
Hung-jen Hsu, Taoyuan, TW;
Yi-ming Dai, Hsin-Chu, TW;
Po-wen Lin, Chia-i, TW;
Te-fu Tseng, Hsin-Chu, TW;
Chih-Kung Chang, Hsin-Chu, TW;
Yu-Kung Hsiao, Tao-Yuan, TW;
Sheng-Liang Pan, Hsin-Chu, TW;
Fu-Tien Wong, Hsin-Chu, TW;
Chin-Chen Kuo, Taipei, TW;
Chung-Sheng Hsiung, Hsinchu, TW;
Hung-Jen Hsu, Taoyuan, TW;
Yi-Ming Dai, Hsin-Chu, TW;
Po-Wen Lin, Chia-i, TW;
Te-Fu Tseng, Hsin-Chu, TW;
Taiwan Semiconductor Manufacturing Co., LTD, Hsin Chu, TW;
Abstract
A method for fabricating a microelectronic product provides for forming a planarizing layer upon a bond pad and a topographic feature, both formed laterally separated over a substrate. The planarizing layer is formed with a diminished thickness upon the bond pad such that it may be readily etched to expose the bond pad while employing as a mask an additional layer formed over the topographic feature but not over the bond pad. The method is particularly useful for forming color filter sensor image array optoelectronic products with attenuated bond pad corrosion.