The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 11, 2005
Filed:
Feb. 26, 2001
Masaru Izawa, Hino, JP;
Masahito Mori, Hachioji, JP;
Nobuyuki Negishi, Kokubunji, JP;
Shinichi Tachi, Sayama, JP;
Masaru Izawa, Hino, JP;
Masahito Mori, Hachioji, JP;
Nobuyuki Negishi, Kokubunji, JP;
Shinichi Tachi, Sayama, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
Automatic generation of processing conditions will be provided, based on a database and process modeling by a computer equipped in semiconductor device fabrication equipment, by using input of wafer processing history including the thickness and quality. The computer equipped in semiconductor device fabrication equipment obtains the wafer processing and inspection results from a production line management computer in order to assist input of the process history. The computer in the fabrication equipment can be connected to computers in a fabrication equipment manufacturer on a communication network to automatically provide process conditions and maintenance schedule.