The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 30, 2004

Filed:

Apr. 15, 2002
Applicant:
Inventors:

Takahiro Kitano, Kumamoto, JP;

Shinichi Sugimoto, Kumamoto, JP;

Shinji Kobayashi, Kumamoto, JP;

Naoya Hirakawa, Kumamoto, JP;

Akira Fukutomi, Kumamoto, JP;

Nobukazu Ishizaka, Kumamoto, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 1/400 ; B05C 1/100 ; B05C 1/106 ; B05C 5/00 ;
U.S. Cl.
CPC ...
C23C 1/400 ; B05C 1/100 ; B05C 1/106 ; B05C 5/00 ;
Abstract

The present invention relates to a processing method for processing a substrate, and comprises a step of coating a coating solution on a surface of the substrate while relatively moving a coating solution discharge nozzle and the substrate and discharging the coating solution from the nozzle onto the substrate. Thereafter, the substrate is exposed to a solvent atmosphere of the coating solution or the pressure is temporarily applied thereto in a container. Thereafter, the pressure inside the container in which the substrate is housed is reduced to dry the coating solution on the substrate. According to the present invention, it is possible to narrow the so-called edge cutting width, which is at a periphery part of the substrate and is not commercialized, and to maintain an in-plane uniformity of the coating film.


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