The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 21, 2004
Filed:
Dec. 20, 2002
Rahul Manepalli, Phoenix, AZ (US);
Terry Sterrett, Cave Creek, AZ (US);
Tian-an Chen, Phoenix, AZ (US);
Vassoudevane Lebonheur, Tempe, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Embodiments of the methods of the present invention provide a Molded Matrix Array Package (MMAP) carrier substrate panel that prevents underfill wetting in the inter-die areas. Surface treatments are provided via plasmas and/or patterned chemical depositions that reduce the surface free energy of the inter-die area to below the surface free energy of the underfill material. The surface treatments prevent the underfill material from wetting the carrier substrate panel and therefore encroachment upon the inter-die area. This provides a underfill material-free inter-die area allowing adhesion between the mold compound and carrier substrate.